Microelectronic devices and methods for forming interconnects in microelectronic devices

ABSTRACT

Microelectronic devices, methods for packaging microelectronic devices, and methods for forming interconnects in microelectronic devices are disclosed herein. In one embodiment, a method comprises providing a microelectronic substrate having a front side and a backside. The substrate has a microelectronic die including an integrated circuit and a terminal operatively coupled to the integrated circuit. The method also includes forming a passage at least partially through the substrate and having an opening at the front side and/or backside of the substrate. The method further includes sealing the opening with a conductive cap that closes one end of the passage while another end of the passage remains open. The method then includes filling the passage with a conductive material.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.11/416,824, filed May 3, 2006, now U.S. Pat. No. 7,329,943, which is adivisional of U.S. patent application Ser. No. 10/879,838, filed Jun.29, 2004, now U.S. Pat. No. 7,232,754, both of which are incorporatedherein by reference in their entireties.

TECHNICAL FIELD

The following disclosure relates generally to microelectronic devicesand, more particularly, to methods for forming interconnects inmicroelectronic devices.

BACKGROUND

Conventional packaged microelectronic devices can include a singulatedmicroelectronic die, an interposer substrate or lead frame attached tothe die, and a molded casing around the die. The die generally includesan integrated circuit and a plurality of bond-pads coupled to theintegrated circuit. The bond-pads are typically coupled to terminals onthe interposer substrate or lead frame, and supply voltage, signals,etc., are transmitted to and from the integrated circuit via thebond-pads. In addition to the terminals, the interposer substrate canalso include ball-pads coupled to the terminals by conductive tracessupported in a dielectric material. Solder balls can be attached to theball-pads in one-to-one correspondence to define a “ball-grid array.”Packaged microelectronic devices with ball-grid arrays are generallyhigher grade packages having lower profiles and higher pin counts thanconventional packages using lead frames.

Packaged microelectronic devices such as those described above are usedin cellphones, pagers, personal digital assistants, computers, and manyother electronic products. To meet the demand for smaller electronicproducts, there is a continuing drive to increase the performance ofpackaged microelectronic devices, while at the same time reducing theheight and the surface area or “footprint” of such devices on printedcircuit boards. Reducing the size of high performance devices, however,is difficult because the sophisticated integrated circuitry requiresmore bond-pads, which results in larger ball-grid arrays and thus largerfootprints. One technique for increasing the component density ofmicroelectronic devices within a given footprint is to stack one deviceon top of another.

FIG. 1 schematically illustrates a first microelectronic device 10attached to a second microelectronic device 20 in a wire-bonded,stacked-die arrangement. The first microelectronic device 10 includes adie 12 having an integrated circuit 14 electrically coupled to a seriesof bond-pads 16. A redistribution layer 18 electrically couples aplurality of first solder balls 11 to corresponding bond-pads 16. Thesecond microelectronic device 20 similarly includes a die 22 having anintegrated circuit 24 electrically coupled to a series of bond-pads 26.A redistribution layer 28 electrically couples a plurality of secondsolder balls 21 to corresponding bond-pads 26. Wire-bonds 13 extendingfrom the first solder balls 11 to the second solder balls 21electrically couple the first microelectronic device 10 to the secondmicroelectronic device 20.

Forming the wire-bonds 13 in the stacked device shown in FIG. 1 can becomplex and/or expensive because it requires placing individual wiresbetween corresponding pairs of contacts (e.g., the first solder balls 11and the second solder balls 21). Further, this type of installation maynot be feasible for the high-density, fine-pitch arrays of somehigh-performance devices because the contacts are not spaced apart farenough to be connected to individual wire-bonds. As such, processes forpackaging the dies have become a significant factor in manufacturingmicroelectronic devices.

To alleviate the problems associated with wire-bonds, Micron Technology,Inc. has developed through-wafer interconnects to electrically couplefront side bond-pads with corresponding backside ball-pads. Thethrough-wafer interconnects described in this paragraph are not admittedprior art, but rather they are described to provide background for theinvention. Many such through-wafer interconnects are constructed byforming a plurality of holes through a microfeature workpiece. Althoughthe through-wafer interconnects developed to date are quite useful, theopen holes in the workpiece may limit certain processing and/orfabrication steps, such as dry etching. For example, the etchant canaffect the materials within the holes. Furthermore, the holes throughthe workpiece do not allow some vacuum chucks to hold the workpiece inplace for vapor deposition processes (e.g., chemical vapor deposition(CVD) or physical vapor deposition (PVD)). Therefore, it would bedesirable to develop a process for forming through-wafer interconnectsthat can be used in dry etching processes and held by vacuum chucks.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side cross-sectional view of a first microelectronic deviceattached to a second microelectronic device in a stacked-die arrangementin accordance with the prior art.

FIG. 2 is a side cross-sectional view of a microfeature workpiececonfigured in accordance with an embodiment of the invention.

FIGS. 3A-3D are schematic side cross-sectional views illustratingvarious stages in a method of forming an interconnect in amicroelectronic device in accordance with an embodiment of theinvention.

FIG. 4A-4C are schematic side cross-sectional views illustrating variousstages in a method of forming an interconnect in a microelectronicdevice in accordance with another embodiment of the invention.

FIGS. 5A-5C are schematic side cross-sectional views illustratingvarious stages in a method of forming an interconnect in amicroelectronic device in accordance with another embodiment of theinvention.

DETAILED DESCRIPTION A. Overview

The following disclosure describes several embodiments ofmicroelectronic devices and methods for packaging microelectronicdevices. One aspect of the invention is directed towards a method forforming an interconnect in a microelectronic device. An embodiment ofone such method comprises providing a microelectronic substrate having afront side and a backside. The substrate has a microelectronic dieincluding an integrated circuit and a terminal operatively coupled tothe integrated circuit. The method further includes forming a passage atleast partially through the substrate and having an opening at the frontside and/or the backside of the substrate. The method continues bysealing the opening with a conductive cap that closes one end of thepassage while another end of the passage remains open. The method thenincludes filling the passage with a conductive material.

In one embodiment, sealing the opening of the passage comprises forminga conductive cap in the passage by electrolessly plating metal (e.g.,Ni) onto the terminal to occlude the opening. In another embodiment,sealing the opening comprises depositing a gold stud bump in theopening. In a further embodiment, sealing the opening comprisesdepositing an aluminum wedge in the passage. In yet another embodiment,sealing the opening comprises depositing a solder ball in the passage.

Another aspect of the invention is directed toward a microelectronicdevice comprising a microelectronic die having an integrated circuit anda terminal electrically coupled to the integrated circuit. Themicroelectronic device also includes a passage extending at leastpartially through the die and having an opening at one end. Themicroelectronic device further includes a conductive cap in electricalcontact with the terminal. The conductive cap occludes the openingwithout completely filling the passage. In several embodiments, aconductive fill material is deposited in the passage and contacts theconductive cap.

Many specific details of the present invention are described below withreference to semiconductor devices. The term “microfeature workpiece,”however, as used throughout this disclosure, includes substrates uponwhich and/or in which microelectronic devices, micromechanical devices,data storage elements, read/write components, and other features arefabricated. For example, such microelectronic workpieces can includesemiconductor wafers (e.g., silicon or gallium arsenide wafers), glasssubstrates, insulated substrates, and many other types of substrates.The feature sizes in microfeature workpieces can include very smallfeatures of 0.11 μm or less, but larger features can also be included onmicrofeature workpieces.

Specific details of several embodiments of the invention are describedbelow with reference to microelectronic dies and other microelectronicdevices in order to provide a thorough understanding of suchembodiments. Other details describing well-known structures oftenassociated with microelectronic devices are not set forth in thefollowing description to avoid unnecessarily obscuring the descriptionof the various embodiments. Persons of ordinary skill in the art willunderstand, however, that the invention may have other embodiments withadditional elements or without several of the elements shown anddescribed below with reference to FIGS. 2-5C.

In the Figures, identical reference numbers identify identical or atleast generally similar elements. To facilitate the discussion of anyparticular element, the most significant digit or digits of anyreference number refer to the Figure in which that element is firstintroduced. For example, element 210 is first introduced and discussedwith reference to FIG. 2.

B. Embodiments of Microfeature Workpieces

FIG. 2 is a side cross-sectional view of a microfeature workpiece 200configured in accordance with an embodiment of the invention. In thisembodiment, the microfeature workpiece 200 includes a substrate 210having a front side 212, a backside 214, and a plurality ofmicroelectronic dies 220 formed on and/or in the substrate 210. Theindividual dies 220 can include an image sensor 224, an integratedcircuit 222 operatively coupled to the image sensor 224, and externalcontacts 230 electrically coupled to the integrated circuit 222. Theimage sensors 224 can be CMOS or CCD image sensors for capturingpictures or other images in the visible spectrum, but in otherembodiments the image sensors 224 can detect radiation in otherspectrums (e.g., infrared (IR) or ultraviolet (UV) ranges). The imagesensors 224 are typically located at the front side 212 of the substrate210.

The external contacts 230 shown in FIG. 2 provide a small array ofball-pads within the footprint of each die 220. Each external contact230, for example, can include a terminal 232 (e.g., a bond-pad), anexternal contact pad 234 (e.g., a ball-pad), and an interconnect 236coupling the terminal 232 to the contact pad 234. The contact pads 234can be connected to other external devices such that the individual dies220 do not need an interposing substrate to be installed on acircuitboard.

One advantage of using interconnects 236 to electrically couple theterminals 232 to the contact pads 234 is that this eliminates the needfor mounting the individual dies 220 to a separate, larger interposersubstrate. The individual dies 220 have a significantly smallerfootprint and profile than the conventional stacked device shown inFIG. 1. Accordingly, the dies 220 can be used in smaller electronicdevices. Furthermore, the interconnects 236 also eliminate having towire-bond the terminals 232 to external contacts. This is useful becausewire-bonds tend to break and are difficult to fabricate on high-densityarrays. Accordingly, the microelectronic dies 220 with the interconnects236 are more robust than dies that require wire-bonds.

In the embodiment illustrated in FIG. 2, the process of forming theinterconnects 236 in the microfeature workpiece 200 has been completed.As described below, FIGS. 3A-5C illustrate various embodiments ofmethods for forming interconnects 236 in the workpiece 200. Although thefollowing description illustrates forming just one interconnect, it willbe appreciated that a plurality of interconnects are constructedsimultaneously through a plurality of dies on a wafer. After forming theinterconnects 236, the microfeature workpiece 200 can be cut along linesA-A to singulate the microelectronic dies 220.

FIGS. 3A-3D illustrate various stages in a method of forming theinterconnects 236 in the microfeature workpiece 200 in accordance withan embodiment of the invention. FIG. 3A, more specifically, is aschematic side cross-sectional view of the area 3A shown on FIG. 2 at anintermediate stage of forming the interconnect 236. At this stage, themicrofeature workpiece 200 has a first dielectric layer 316 on the frontside 212 of the substrate 210 and a second dielectric layer 317 on thefirst dielectric layer 316. The second dielectric layer 317 has anopening 320 over the terminal 232. The opening 320 can be etched intothe second dielectric layer 317 to expose the terminal 232. In oneembodiment, the first and second dielectric layers 316 and 317 are apolyimide material, but these dielectric layers can be othernonconductive materials in other embodiments. For example, the firstdielectric layer 316 and/or one or more subsequent dielectric layers canbe a low temperature chemical vapor deposition (low temperature CVD)material, such as tetraethylorthosilicate (TEOS), parylene, siliconnitride (Si₃Ni₄), silicon oxide (SiO₂), and/or other suitable materials.The foregoing list of dielectric materials is not exhaustive. Inaddition, one or more of the dielectric layers described above withreference to FIG. 3A, or described below with reference to subsequentfigures, may be omitted.

The workpiece 200 also includes a via or passage 330 extending throughthe substrate 210 and the terminal 232. The passage 330 includes a firstportion 332 defined by the opening 333 at the front side 212 of thesubstrate 210 and a second portion 334 at the backside 214 of thesubstrate 210. The passage 330 can be formed using a laser-cuttingmethod at least generally similar to one or more of the methodsdescribed in U.S. patent application Ser. No. 10/713,878, entitled“Microelectronic Devices, Methods for Forming Vias in MicroelectronicDevices, and Methods for Packaging Microelectronic Devices,” filed onNov. 13, 2003 and incorporated herein in its entirety. In otherembodiments, the passage 330 can be formed using other methods, such asa suitable etching or drilling method.

After the passage 330 is formed, a third dielectric layer 318 is appliedto the microfeature workpiece 200 to cover the sidewall of the passage330 in the substrate 210. The third dielectric layer 318 can be appliedusing CVD, PVD, atomic layer deposition (ALD), or other depositionprocesses. The third dielectric layer 318 generally completely coats thesidewall of the passage 330, but in some embodiments the thirddielectric layer 318 covers only a portion of the sidewall. In theillustrated embodiment, the third dielectric layer 318 is applied to theentire microfeature workpiece 200 so that it covers the exposed portionsof the substrate 210, the terminal 232, and the second dielectric layer317. The third dielectric layer 318 can be a low temperature CVD oxide,but in other embodiments the third dielectric layer 318 can be othersuitable dielectric materials as described above. The third dielectriclayer 318 electrically insulates the components of the substrate 210proximate to the passage 330 from conductive material that issubsequently deposited into the passage 330 to form the interconnect236, as described in greater detail below.

Referring next to FIG. 3B, the method continues by removing portions ofthe third dielectric layer 318 from the horizontal and diagonal surfacesat the front side 212 of the workpiece 200. In one embodiment, the thirddielectric layer 318 is etched using a process that preferentiallyremoves material at a higher etch rate from horizontal surfaces andsurfaces having horizontal components relative to the direction of theetchant. Several suitable etching processes are spacer etches. In otherembodiments, different processes can be used to selectively removenonvertical portions of the third dielectric layer 318 so that thevertical portions of the third dielectric layer 318 on the sidewalls inthe passage 330 remain on the workpiece 200.

Referring next to FIG. 3C, the method further includes forming aconductive cap 340 at the opening 333 to seal the first portion 332 ofthe passage 330. In this embodiment, the conductive cap 340 is platedonto the terminal 232 using an electroless plating process. For example,the conductive cap 340 can be Ni that plates onto the terminal 232 untilthe first portion 332 of the passage 330 is “pinched-off.” The cap 340seals the first portion 332 of the passage 330. In other embodimentsdescribed below, the conductive cap 340 includes other materials and/oris formed using other processes.

Referring next to FIG. 3D, the method continues by filling at least aportion of the passage 330 with a conductive material 350 to form theinterconnect 236. In one embodiment, the fill material 350 iselectrolytic nickel, electrolytic copper, electrolytic solder,electroless nickel, electroless copper, conductive polymer paste, moltensolder, or other electrically conductive materials. Various processescan be used to deposit the fill material 350 into the passage 330. Forexample, a conductive element 370 is pressed against the conductive cap340 and biased at an electrical potential to electroplate the conductivematerial 350 within the passage 330 in a “bottom-up” plating process. Inother embodiments, other methods may be used to bias the conductive cap340 at an electrical potential suitable for electroplating material intothe passage 330, or other methods for filling vias known to those in theart may be used.

The workpiece 200 with the conductive cap 340 has several advantagescompared to conventional processes that leave the passage 330 openbefore depositing the conductive material into the passage 330. Oneadvantage of sealing the passage 330 with the conductive cap 340 is thatit allows the workpiece 200 to be releasably secured to a vacuum chuckusing suction, which enables the use of chemical-mechanicalplanarization (CMP) processes. In contrast, it is difficult to secureworkpieces with open passages using vacuum chucks.

Another advantage of using the conductive cap 340 to seal the end of thepassage 330 is that it protects the passage 330 from other fabricationprocesses. For example, processes such as dry etching or subsequent filmdeposition can contaminate and/or damage the passage 330 and thesubstrate 210. By sealing the passage 330 with the conductive cap 340,contamination or damage to materials within the passage 330 ismitigated.

Yet another advantage of using the conductive cap 340 to seal thepassage 330 is that the conductive cap 340 enables bottom-up plating.High-aspect vias, such as the passage 330, are generally very difficultto plate because plating using a conformal seed layer can causepinch-off and voids. However, the conductive cap 340 in the presentembodiment provides bottom-up electroplating for filling the passage 330with the conductive material 350.

C. Additional Embodiments of Methods for Forming Interconnects inMicrofeature Workpieces

FIGS. 4A-4C are schematic side cross-sectional views illustratingvarious stages of a method for forming the interconnect 236 in themicrofeature workpiece 200 of FIG. 2 in accordance with anotherembodiment of the invention. The initial stages of this method are atleast generally similar to the steps described above with respect toFIG. 3A; accordingly, like reference numbers refer to like components inFIGS. 3A and 4A.

Referring first to FIG. 4A, the workpiece 200 includes a passage 430extending through the substrate 210 and the terminal 232. The passage430 differs from the passage 330 of FIG. 3A in that the passage 430 isslightly tapered. After forming the passage 430, a third dielectriclayer 418 is deposited onto the workpiece 200 to cover the sidewall ofthe passage 430 within the substrate 210. In practice, the thirddielectric layer 418 generally covers at least a portion of the terminal232 and the second dielectric layer 317 in addition to the exposedportion of the substrate 210 in the passage 430. As described above, thethird dielectric layer 418 is etched to expose surfaces on the front andback of the workpiece 200 outside the passage 430.

Referring next to FIG. 4B, the method includes forming a conductive cap440 at a first portion 432 of the passage 430 adjacent to the terminal232. In this embodiment, for example, the conductive cap 440 is formedby depositing a gold stud bump at an opening 433 in the passage 430 toocclude the first portion 432 of the passage 430. In other embodiments,the conductive cap 440 that seals the first portion 432 of the passage430 can be formed by depositing an aluminum wedge stud or a solder cap.For example, the solder cap can be formed by depositing a solder ball,solder paste, or a solder preform at the first portion 432 of thepassage 430 and then reflowing the solder to form the conductive cap440. In yet other embodiments, the conductive cap 440 can include otherelectrically conductive materials, such as copper, palladium, and/orvarious solders. In still further embodiments, the conductive cap 440can be formed using an electroplating process as described above withrespect to FIG. 3C.

Referring next to FIG. 4C, the method proceeds by filling at least aportion of the passage 430 with a conductive material 450 to form theinterconnect 236. In the illustrated embodiment, the fill material 450is nickel, copper, solder, conductive polymer paste, or otherelectrically conductive materials. Various processes can be used todeposit the fill material 450 into the passage 430. As with the methoddescribed above in FIGS. 3A-3D, for example, a conductive element 470 ispressed against the conductive cap 440 and biased at an electricalpotential to electroplate the conductive material 450 within the passage430. In other embodiments, other deposition methods can be used to biasthe conductive cap 440 at an electrical potential suitable forelectroplating material into the passage 430. In yet other embodiments,other methods known to those of skill in the art may be used to depositthe fill material 450 into the passage 430.

FIGS. 5A-5C are schematic side cross-sectional views illustratingvarious stages in a method of forming the interconnect 236 in themicrofeature workpiece 200 of FIG. 2 in accordance with anotherembodiment of the invention. The initial stages of this method are atleast generally similar to the steps described above with respect toFIG. 3A; accordingly, like reference numbers refer to like components inFIGS. 3A and 5A.

Referring first to FIG. 5A, the workpiece 200 includes a passage 530extending only partially through the substrate 210. The passage 530differs from the passage 330 of FIG. 3A in that the passage 530 is ablind hole. As used herein, a “blind hole” refers to a hole or aperturethat extends only partially through the substrate 210. In oneembodiment, the passage 530 is etched to an intermediate depth withinthe substrate 210. In other embodiments, the passage 530 may be drilledusing a laser or formed using other processes known to those of skill inthe art. After the passage 530 is formed, a third dielectric layer 518is deposited onto the workpiece 200 to cover the sidewalls of thepassage 530 in the substrate 210. The third dielectric layer 518 can beone of the materials described above with respect to FIG. 3A. In otherembodiments, the third dielectric layer 518 may be formed using othernonconductive materials.

Referring next to FIG. 5B, the method proceeds by forming a conductivecap 540 at a first portion 532 of the passage 530 adjacent to theterminal 232. The conductive cap 540 is formed using any of thematerials and processes described above with respect to FIGS. 3C and 4B.After forming the conductive cap 540, the backside 214 of the substrate210 is thinned to expose a second portion 534 of the passage 530. Thebackside 214 of the substrate 210 is thinned using CMP processes, dryetching processes, chemical etching, chemical polishing, backgrinding,or other suitable grinding processes known to those of skill in the art.

Referring next to FIG. 5C, after opening the second portion 534 of thepassage 530, the remaining portion of the passage 530 is filled with aconductive material 550 to form the interconnect 236 extending throughthe substrate 210. The fill material 550 can be at least generallysimilar to the materials described above with respect to FIGS. 3D and4C. In the illustrated embodiment, the fill material 550 is depositedinto the passage 530 using a bottom-up plating process. In otherembodiments, different methods known to those of skill in the art may beused to deposit the fill material 550 into the passage 530.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. For example, various aspects of anyof the foregoing embodiments can be combined in different combinations.Accordingly, the invention is not limited except as by the appendedclaims.

1. A method of protecting a through-silicon opening during processing,wherein the through-silicon opening extends at least partially through amicroelectronic substrate having a front side and a back side, anintegrated circuit, and a terminal at the front side of the substrateoperatively coupled to the integrated circuit, the method comprising:forming a via extending at least partially through the substrate and theterminal, wherein the via is at least partially hollow and has anopening at the terminal; and closing off the opening with a conductivecap that is in electrical contact with the terminal.
 2. The method ofclaim 1, further comprising depositing a conductive fill material intothe via and in contact with the conductive cap.
 3. The method of claim2, further comprising applying a dielectric liner to at least a portionof the via before closing off the opening with the conductive cap. 4.The method of claim 2 wherein depositing a conductive fill material intothe via comprises at least partially filling the via with electrolyticnickel, electrolytic copper, electrolytic solder, electroless nickel,electroless copper, conductive polymer paste, and/or molten solder. 5.The method of claim 1 wherein forming the via comprises forming a viaaligned with the terminal and extending completely through the substrateand the terminal.
 6. The method of claim 1 wherein: forming the viacomprises forming a blind hole extending from the front side of thesubstrate to an intermediate depth within the substrate; and closing offthe opening comprises forming the cap proximate to the front side of thesubstrate and in contact with the terminal.
 7. The method of claim 1wherein closing off the opening with the conductive cap comprises usingan electroless plating technology to seal a portion of the via.
 8. Themethod of claim 1 wherein closing off the opening with the conductivecap comprises applying Ni in an electroless plating process to seal aportion of the via.
 9. The method of claim 1 wherein closing off theopening with the conductive cap comprises depositing a stud bump to seala portion of the via.
 10. The method of claim 1 wherein closing off theopening with the conductive cap comprises depositing an aluminum wedgeto seal a portion of the via.
 11. The method of claim 1 wherein closingoff the opening with the conductive cap comprises depositing a solderball to seal a portion of the via.
 12. A method of forming aninterconnect in a microelectronic workpiece, the workpiece including asubstrate having a front side and a back side, an integrated circuit,and a terminal at the front side of the substrate and electricallycoupled to the integrated circuit, the method comprising: forming a viaextending through the substrate and the terminal, the via having anopening at the terminal; disposing metal onto the substrate at leastproximate to the opening until the metal pinches off the opening,wherein another end of the via remains open; and filling at least aportion of the via with a conductive material, wherein the conductivematerial contacts the metal pinching off the opening.
 13. The method ofclaim 12 wherein disposing metal onto the substrate compriseselectrolessly plating metal onto the terminal until the metal pinchesoff the opening.
 14. The method of claim 12 wherein disposing metal ontothe substrate comprises electrolessly plating nickel onto the terminaluntil the nickel pinches off the opening.
 15. The method of claim 12wherein disposing metal onto the substrate comprises depositing a soldermaterial onto the terminal and pinching off the opening.
 16. The methodof claim 12 wherein disposing metal onto the substrate comprisesdepositing an aluminum wedge onto the terminal and pinching off theopening.
 17. The method of claim 12, further comprising: applying adielectric liner to at least a portion of the via before disposing metalonto the substrate; positioning a conductive member adjacent to thefront side of the substrate and in electrical contact with the metalpinching off the opening; and electrically biasing the metal pinchingoff the opening at a potential with the conductive member toelectroplate the conductive material into the via.
 18. The method ofclaim 12 wherein filling at least a portion of the via with a conductivematerial comprises constructing an electrically conductive interconnectthrough the substrate and in electrical contact with the terminal. 19.The method of claim 12 wherein filling at least a portion of the viawith a conductive material comprises depositing the conductive materialinto the via using an electroplating process.